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From: Austin Lesea on
Brian,

Sigh.

See below.

Austin

Brian Davis wrote:

> Austin,
>
>>Lots of scope shots are available (ask your FAE).
>>
>
> Then why not publish them, along with a comparison of IBIS/HSPICE
> simulations versus the real world measurements?
All I can say, is that they are coming. Just takes awhile. Right now
we have much more important things to do: tout our power advantage, our
static current advantage, our speed advantage, our MGT advantage, our
PPC advantage, our SI packaging breakthrough ...
Showing an IBIS simulation of a five year old interface is just not high
on our list -- too many customers use it, and are perfectly delighted
with it. We do not want to be defocused and stop pointing out the areas
where we are clearly superior.
>
>
>>But, I am sure our Marketing Folks will be rolling our scope shots
>>as part of pitch-packs, etc. for those who are unable or unwilling
>>to do the SI engineering that their job requires of them.
>>
>
>
> Let's see if I've got this straight [1]:
>
> A) Xilinx publicly posts in FPGA and SI forums touting their
> real world X vs. A package testing, and asks for feedback [2]
Sure.
>
> B) Forum users post some suggested measurements, which a
> certain Xilinx employee says they can make
I did. Yes.
>
> C) Two months later, when asked when said measurements might
> be published, the very same Xilinx employee cops an attitude
OK, so I was snippy. I am told that the measurements will be done, but
again, it isn't a high priority.
>
>
>>Get the ML450 board, or ask for the documentation.
>>
>
>
> That would be the same manual (UG077 v1.2) that mentions a
> HyperTransport compliant DUT interface connector, without
> pointing out that the the specified V4 FPGA Cin is 5x the
> allowed HyperTransport max Cin for a 1 Gbps part ???
True: we are not an ASIC/ASSP. That is the one area where they win
(they can make these specs as tight as they please). But guess what?
We are growing, increasing sales, and ASICs are not. Our real
competition now is no longer other FPGA companies; it is the ASIC/ASSP
providers. We can supply features and circuits on technologies they
can't (yet). Who has 10 Gbs transceivers? Who has the lowest power
405PPC? Who has the lowest power/highest performance DSP48 blocks for
DSP applications? We do, they don't.
>
> As to why that matters: a HyperTransport test probe attempting
> to monitor the input link to the FPGA can't function properly
> because Cin reflections off the FPGA would prevent the probe from
> properly clocking the data at the mid T-line probe sampling point.
I claim in a real system, with a compliant transmitter, there will be
sufficient return loss matching to make the eye visible, and useful.
But, I agree, that in some cases, what you see is not what you get.
That can happen with a simple single ended input pin, and is definitely
true about 1Gbs, where observing it, breaks it (often). I think that
there is a whole class of people out there who have to see it to believe
it. OK. But, they should get used to the fact that none of the test
equipment is really fast enough to show them what they want to see. And
it is only getting worse.
>
> There are ways around this, but life would be easier if Xilinx
> actually bothered to meet the spec in the first place.
Already explained why we can't do that: 35 IO standards in one pin has
to make some compromises.
>
> Lacking that, proper documentation of your part's shortcomings,
> and how and when to work around them, would be appropriate.
We got all that. That is what the user's guide is for. That is what
the datasheet is for. Should we place a billboard on 101 South that
states the IOB pin capacitance is ~ 12pF? It is already in the
datasheet. So is the MGT, PPC, DSP48, etc. What do you think we should
spend time on?
>
>
> Brian
>
>
> [1] Speaking of those unable to perform the SI engineering that is
> required of them : when might we expect publication of characterized
> static DCI power and DCI impedance modulation limits for the five year
> old Virtex2 FPGA family ?
I think all this is now covered between data sheets, user's guides, and
technical answers on our website. Let me know if there is something
missing between those three resources.

Generally speaking, if we don't specify it, then you are on your own to
use it there. For example, if you chose to set the resistance to 100
ohms, to match a 100 ohm single ended line, we are not going to claim we
meet any standard (there isn't any), and we aren't going to spend time
characterizing all the silicon for it. I believe we state the range of
the resistance from 40 ohms to 150 ohms, but when you use it at anything
other than 50 ohms, you are required to check it out (I would run the
spice simulations -- you may request impedances other than 50 ohms for
the spice models of DCI, 40, 50, 68, and 75 are the ones we have if I
recall correctly), as that is not any one of the 35 IO standards that we
designed the IOB to support.

A small change, such as using the DCI at 68 ohms instead of 50 ohms is
used by quite a few (to save power). You can characterize it if you
need to, and if you feel there is a benefit you can derive, but unusual
usage of a feature in an area it was not intended to be used (not
specified), is not guaranteed.
From: fastgreen2000 on
Thank you all for responses. I didn't mean to start a spark, even
though I was curious about what Stratix/II could do in comparison.

I'm now leaning toward doing it - parts of core @360, DDR data output
@360 (720, effectively) along with forwarded clock @360. I'd be
running simulation to make sure there isn't any big issue at 720Mbps,
but since it's much lower than 1.2Gbps, I'm optimistic.

Can't say Altera is out of running, however. I just wanted to make
sure I could do it in some FPGA device before committing to the
interface.

Thanks again.

From: Symon on
"Brian Davis" <brimdavis(a)aol.com> wrote in message
news:1115862089.794227.150660(a)f14g2000cwb.googlegroups.com...
>
> Best wishes on getting Austin to stop with his
> "but it's really half, differentially" handwaving.
>
> I've tried before, with results similar to that
> "but it goes to Eleven" bit from "Spinal Tap".
>
Brian, LOL, I'm beginning to feel the same way. It's interesting that almost
all the PCB differential pairs I've seen are edge coupled striplines or
microstrips, very few are broadside coupled. Of course, usually with edge
coupled lines most of the coupling is to the ground plane, and very little
between the conductors. So, it's much more like two 50 Ohm lines rather than
a 100 Ohm pair. Not that it makes any difference, of course.
> >
> >a way to improve things is to drive this capacitance
> >with a lower impedance
> >
>
> Also, when you've got plenty of drive margin, a differential
> attenuator ahead of the FPGA (with internal termination) works
> nicely to attenuate the reflection, and also makes for a convenient
> differential probe point. If you have 6dB to spare, even the most
> horrible of loads presents at least 12dB return loss, with the probe
> seeing 1/4 the reflection voltage of the original circuit.(however, the
> attenuator doesn't lower the drive impedance as does your suggestion )
>
Yep!
Cheers, Syms.


From: Jim Granville on
Austin Lesea wrote:

<snip>
>> There are ways around this, but life would be easier if Xilinx
>> actually bothered to meet the spec in the first place.
>
> Already explained why we can't do that: 35 IO standards in one pin has
> to make some compromises.

Perhaps it is time to make some pins less "jack of all trades, master
of none", and provide some with more focus ?

-jg

From: Austin Lesea on
Jim,

It is something we agonize over everytime we look at a new family.

Should we add IO standard specific IOB's? How many? How are they to be
organized?

What should the IO/CLB ratio be?

Or, should we continue with the present plans (if it ain't broke, don't
fix it)?

What business did we lose because we could not meet a customer's
requirement? How do we know we even lost any business at all?

We did add MGTs (and PPC's, EMAC's, DSP48's, ECC_BRAM's, FIFO_BRAM's,
etc), so it isn't like we are not looking at adding new things, or
mixing things up (the patented ASMBL architecture for example).

360 MHz, 720 Mbs DDR LVDS is now over five years old as something that
either X or A has provided with their devices. One can argue the fine
points, but as a gross capability, it has been there for quite awhile.

Austin

Jim Granville wrote:

> Austin Lesea wrote:
>
> <snip>
>
>>> There are ways around this, but life would be easier if Xilinx
>>> actually bothered to meet the spec in the first place.
>>
>>
>> Already explained why we can't do that: 35 IO standards in one pin
>> has to make some compromises.
>
>
> Perhaps it is time to make some pins less "jack of all trades, master
> of none", and provide some with more focus ?
>
> -jg
>
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