From: N_Cook on
Can anyone put age/years interpretation to the green/yellow/red solder-type
rankings in this publically available document?

http://teerm.nasa.gov/LFS%20Reliability/Solder%20Comparison%20by%20Component
%20Level%20Life_Use%20%20Analysis_Final.pdf


Unfortunately, this test data demonstrated that for some component types the
lead-free solders failed before the
SnPb control. References 1 & 2 stated that models for calculating the
actual field lifetime of lead-free solder joints
on certain component types will need to be developed due to their reduced
life capabilities relative to SnPb.

...

Vibration testing was conducted by Boeing Phantom Works (Seattle) for the
Joint Council on Aging Aircraft/Joint
Group on Pollution Prevention (JCAA/JGPP) Lead-Free Solder Project. The
JCAA/JG-PP Consortium is the first
group to test the reliability of leadfree solder joints against the
requirements of the aerospace/military community
(1,2).

Test vehicles were specially constructed circuit cards, capable of instant
detection of failure of all components.
Each test vehicle was 12.75 inches by 9 inches in size, 0.090 inches thick
and was populated with 55 components
consisting of ceramic leadless chip carriers (CLCC's), plastic leaded chip
carriers (PLCC's), TSOP's, TQFP's,
BGA's, and PDIP's. Sets of identical components were used in different
positions on the cards. The circuit cards were supported by WedgeLoks on
the two 9 inch edges. Thirty circuit cards were vibration tested.